Modular Solution Approach For Simulation Of Coupled Physical Phenomena
Free (open access)
S. Schulte, A. Maurer & H. Bungartz
The design process of micromechanical components is mainly based on numerical modeling to predict the behaviour of such devices. A typical problem which occurs in the simulation of microsytem technology is the necessity for dealing with coupled physical phenomena like the interaction between structural dynamics, fluid dynamics, heat transfer, or electrostatics, e.g. Furthermore couplings between models on different levels of simulation such as the physical level and the system level have to be considered. After presenting a classification of the most important couplings in the microsystem world a survey on existing solution techniques is given with emphasis on the so-called partitioned solution.