Author(s)

J. Helm

Abstract

Here a coupled experimental and calculation technique for examination of thermal environments is presented. Its application to the extraction of geomet- ric and thermal material parameters, calculation of thermal resistances etc., is demonstrated. The calculation tool is based on a Fourier-Galerkin approach and is applicable to rectangular 3-dimensional chips on substrates with sev- eral layers. The experimental part (electro-thermal measurement) consists of a thermal test chip and its corresponding evaluation system. 1. The calculation algorithm -The microsystem model The algorithm is exemplified for 4 layers (C: chip, K: adhesive, SI and S2: 2 substrate layers alumina ceramics and heat conductive paste (hep)) and a mi- crosystem model as de

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