WIT Press


Specific Problems Of FEM Thermal Simulations For Microsystems

Price

Free (open access)

Paper DOI

10.2495/MIC950171

Volume

13

Pages

10

Published

1995

Size

969 kb

Author(s)

A. Gotz, C. Cane & E. Lora-Tamayo

Abstract

Microsystems often require special attention to the thermal aspects, as they frequently integrate severe heat sources together with electronics. When Finite Element Method programs are used for the solution of these problems, difficulties different from normal ICs are encountered, like, for example, thin membranes with huge aspect ratios and natural and forced convection in microcavities. Some of these aspects are discussed for the example of ANSYS 5.1 simulations of a 3-D multichip microsystem including a thermopneumatic micropump. 1. Heat transport mechanisms in a microsystem Fig. 1 shows an example of a microsystem investigated in the European ESPRIT project BARMINT. It consists of a set of up to ten chips with variable functions. The chips are glued onto a silicon support, stac

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