WIT Press


Fatigue Damage Formation And Microstructure Of Ultrafine Grained Copper Under Two-step Loading

Price

Free (open access)

Paper DOI

10.2495/CMEM130261

Volume

55

Pages

10

Page Range

317 - 326

Published

2013

Size

1,521 kb

Author(s)

M. Goto, S. Z. Han, K. Euh, N. Teshima, T. Yakushiji & N. Kawagoishi

Abstract

In order to study the effect of stress change on the surface damage formation of ultrafine grained copper, two step fatigue stress tests were conducted. The microstructural evolution and crack growth direction of ultrafine-grained copper fatigued under constant stressing depends on the magnitude of the applied stress amplitude. The growth direction occurred perpendicular to the loading axis at low stresses, and changed to 45° to the loading axis at high stresses. In the case of high-to-low block stressing, the 45° inclined growth direction under high stress changed to the perpendicular direction under subsequent low stress. In low-to-high block stressing, although the growth direction perpendicular to the loading axis at low stresses was still retained at subsequent high stress, the degree of zigzag behaviour in the crack growth drastically increased after the stress change. The sizes and topographies of evolved microstructures, which have a great effect on the crack path formation, depended on stress histories (order, cycle number and magnitude of the applied stress). The formation behaviour of the fatigue damage under high- and low-stress amplitudes and the effect of pre-stressing on crack growth direction are discussed from the viewpoints of the microstructural evolution under different stress histories. Keywords: ultrafine grain, copper, fatigue, two-step loading, surface damage.

Keywords

Keywords: ultrafine grain, copper, fatigue, two-step loading, surface damage.