WIT Press


Free-edge Stresses In Copper-solder Systems

Price

Free (open access)

Paper DOI

10.2495/BT970441

Volume

16

Pages

10

Published

1997

Size

814 kb

Author(s)

J.R. Berger, J.P. Lien and W.V. Fehringer

Abstract

We investigate the free-edge stresses in copper-solder bimaterials through the use of the free-edge stress intensity factor, Bj. This requires first a determination of the singularity order at the free-surface as well as a calculation of the near-field stresses. We determine the order of the singularity for arbitrary free-surface orientation of the solder using the eigenvalue analysis of Ting for anisotropic bimaterials. The interfacial stresses are determined using a boundary element calculation based on anisotropic, bimaterial Green's functions. The variation of B\ with free-surface orientation is determined. We find that the free-edge singularity is not present for solder angles below 76 degrees. 1 Introduction Most composite materials are subject to failure initiation where an interface me

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