Author(s)

Chin Young Cha & Shridhar V. Iyer

Abstract

Frit salvage improvement of cathode ray tube by thermal method Chin Young Cha & Shridhar V. Iyer Philips Display Components, Inc., Ann Arbor, Michigan, 48108-9108 USA Joseph J. Rencis Mechanical Engineering Department, Worcester Polytechnic Institute, 100 Institute Road, Worcester, Massachusetts 01609-2240 USA This paper describes how a thermal stress boundary element analysis was carried out to select a mechanical device that improves the frit salvage of a cathode ray tube (CRT). The panel and funnel of a CRT are fritted at the seal edge. To reuse a CRT, the panel and funnel are separated by etching and then applying a thermal shock. This procedure is known as frit salvage. Current yield of the frit salvage success rate is about 67% which means that 33% of the components are lost and cannot be reused. The financial burden on the company can be reduced if the salvage rate can be improved through having a better understanding of the thermal shock mechanism. During thermal sh

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