WIT Press


Flow Stress And Dislocation-interface Interaction In Thin Metallic Films: An Atomistic Analysis

Price

Free (open access)

Paper DOI

10.2495/MC030071

Volume

43

Pages

10

Published

2003

Size

733.85 kb

Author(s)

E. S. Ege & Y.-L. Shen

Abstract

The atomistics of interface-mediated plasticity in thin metallic films is numerically studied. Molecular statics simulations were undertaken to model the tensile response of the free-standing and substrate-attached films. In the freestanding film dislocation glide readily occurs, inducing slip steps at both surfaces of the film. The existence of an interface with the substrate constrains the dislocation motion and restricts the slip steps to only the free surface. The propensities of film plasticity and of spreading of relatively energetic atoms associated with the dislocation near the interface are both dictated by the capability of atoms to slide along the interface. The flow stress of the film can be correlated with the dislocation activities. The evolution of voiding damage leading to final frac

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