WIT Press


A Micromechanical Model For Coupled Interaction Of Thermomechanical And Corrosion Fatigue In Microelectronics Thin-film Metallizations.

Price

Free (open access)

Paper DOI

10.2495/SURF010401

Volume

33

Pages

10

Published

2001

Size

727 kb

Author(s)

H.M. Shodja

Abstract

A micromeehanical model for coupled interaction of thermomechanical and corrosion fatigue in microelectronics thin-film metallizations H. M. Shodja Department of Civil Engineering Sharif University of Technology, Iran. Abstract Having studied the intergranular crack nucleation in bicrystalline materials under fatigue [1], the concepts are extended to innovative treatise of crack initiation in thin-film metallizations under coupled interaction of thermomechanical fatigue (TMF) and corrosion. The pile-up of dislocations under thermal cycling and diffusion of corrosive agents have interacting effects in accelerating crack nucleation. It is shown that the corresponding evolutionary partial differential equation (PDE), which governs diffusion of the corrosive agent, contains two terms that involve the first and second spatial derivatives of hydrostatic pressure. Through dependence of the hydrostatic pressure on normal stresses caused by dislocations within th

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