WIT Press


Surface Morphology And Residual Stress Of Electroplated And Electroless Copper Deposits.

Price

Free (open access)

Paper DOI

10.2495/SURF010271

Volume

33

Pages

15

Published

2001

Size

2,703 kb

Author(s)

K.G. Keong, W. Sha, Z.X. Guo & S. Malinov

Abstract

Surface morphology and residual stress of elec troplated and electroless copper deposits K. G. Keong\ W. Sha\ Z. X. Guo" & S. MalimV ^School of Civil Engineering, TJie Queen 's University of Belfast, UK. ^Department of Materials, Queen Mary and Westfield College, UK. Abstract In this work, surface morphology characterisation and residual stress measure- ments have been carried out on electroplated and electroless copper deposits. The surfaces of the solution and substrate sides of the freestanding electroplated copper deposits from stainless steel substrates have been studied at as-deposited condition and after heat treatment at 140°C for 1 hour. Electroless copper depos- its with different substrates (copper cladded and laminated polymers, and screen- printed dielectric substrate) have also been studied at the two conditions. The surface morphology has been characterised using optical microscopy and scan- ning electron microscopy (SEM). Residual surface stress measurements were perfo

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