WIT Press


Stress Intensity Factor Analysis For An Interface Crack Between Dissimilar Isotropic Materials Under Thermal Stress

Price

Free (open access)

Paper DOI

10.2495/DM000061

Volume

26

Pages

10

Published

2000

Size

907 kb

Author(s)

T. Ikeda & C.T. Sun

Abstract

Stress intensity factor analysis for an interface crack between dissimilar isotropic materials under thermal stress T. Ikeda* & C. T. Sun* I Chemical Engineering Group, Department of Materials Process Engineering, Graduate School of Engineering, Kyushu University, Japan 2 School of Aeronautics and Astronautics, Purdue University, USA Abstract Thermal stresses, one of the most important causes of interfacial failure between dissimilar materials, arise from different coefficients of linear thermal expansion. An efficient numerical procedure in conjunction with the finite element method (FEM) for the stress intensity factor (SIF) analysis of interface cracks under thermal stresses is presented. The crack closure integral method is modified using the superposition method. The SIF analyses of some interface crack problems under mechanical and thermal loads are demonstrated. Very accurate mode separated SIF's are obtained. 1 Introduction The stress intensity factors (SIF'

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