Author(s)

K. S. Chen

Abstract

Modeling electrodeposition in LIGA micro-fabrication using an arbitrary Lagrangian-Eulerian formulation for movingboundary tracking with repeated re-meshing K. S. Chen Sandia National Laboratories, USA Abstract Electrodeposition is a key process in LIGA (Uthographie, Galvanoformung, Abformung - German words for lithography, electroplating and molding) - microfabrication, which is increasingly demonstrated to be a viable technology for fabricating micro-devices or parts. LIGA Electrodeposition involves complex multi-physics phenomena: 1) diffusion, migration, and convection of charged species in a centimeter-scale electrolyte-bath region and in micron-scale featurecavity or trench regions; 2) homogeneous and heterogeneous electrochemical reactions; and 3) moving deposition surface or surfaces on which metal ions (e.g., ~ i " ) are electrochemically reduced to form a pure metal or an alloy. In this paper we report efforts toward developing a predictive multidimensional computer model for simula

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