WIT Press


Heat Transfer In Electronics: A BEM Approach

Price

Free (open access)

Paper DOI

10.2495/EBEM980191

Volume

20

Pages

7

Published

1998

Size

483 kb

Author(s)

G. de Mey

Abstract

This paper deals with some particular problems of heat trans- fer by conduction in microelectronic components. It turns out that for all the equations, the fundamental solution is known in a closed analytical form, making the link with the Boundary Element Method straightforward. 1 Introduction This paper deals with two different topics. First of all with ther- mal aspects in electronics design and secondly with the boundary

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