WIT Press

Thermal Analysis For Cracks Near Interfaces Between Piezoelectric Materials

Price

Free (open access)

Paper DOI

10.2495/FR980021

Volume

19

Pages

10

Published

1998

Size

652 kb

Author(s)

Q. Qin & Y. Mai

Abstract

A crack of arbitrary size and orientation near bimaterial interfaces between dissimilar thermopiezoelectric materials is considered. A system of singular integral equations for the unknown thermal analog of dislocation density defined on the crack faces is derived by way of the Strops formulation and the thermoelectroelastic Green's functions developed recently. The stress and electric displacement intensity factors are then computed by numerically solving these singular integral equations. Numerical results are obtained to elucidate the effects of crack orientation. 1 Introduction The widespread use of piezoelectric materials in structural applications has generated renewed interest in thermoelectroelastic behavior. In particular, informati

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