WIT Press


Growth Behavior Of Small Surface Cracks In Coarse And Ultrafine Grained Copper

Price

Free (open access)

Paper DOI

10.2495/CMEM090451

Volume

48

Pages

12

Page Range

497 - 508

Published

2009

Size

3,251 kb

Author(s)

M. Goto, S. Z. Han, Y. Ando, N. Kawagoishi, N. Teshima & S. S. Kim

Abstract

Since fatigue life of a plain specimen of ductile metals is controlled mainly by the propagation life of a small surface crack, to clarify the growth behavior of a small crack is crucial to the safe design of smooth members. However, little has been reported on the growth behavior of small surface cracks in ultrafine grained (UFG) metals. In the present study, stress-controlled fatigue tests for coarse grained (CG) and UFG copper were conducted. The surface damage evolution during cyclic stressing was observed by optical microscopy, and the growth behavior of a small surface crack was monitored by a plastic replication technique. The physical background of fatigue damage for CG and UFG copper was discussed from the viewpoints of the initiation and growth behavior of small surface cracks. Keywords: equal channel angular pressing, copper, ultrafine grain, fatigue, small surface-crack.

Keywords

equal channel angular pressing, copper, ultrafine grain, fatigue, small surface-crack.