WIT Press


Boundary Element Analysis Of Interface Stress State In A Bonded Viscoelastic Thin Film

Price

Free (open access)

Paper DOI

10.2495/BE990081

Volume

25

Pages

9

Published

1999

Size

620 kb

Author(s)

Sang Soon Lee

Abstract

This paper deals with the stress singularity induced at the interface corner between the viscoelastic thin film and the rigid substrate as the film absorbs moisture from the ambient environment. The time-domain boundary element method is employed to investigate the behavior of interface stresses. The order of the free-edge singularity is obtained numerically for a given viscoelastic model. It is shown that the free-edge stress intensity factor is relaxed with time, while the order of the singularity increases with time for the viscoelastic model considered. 1 Introduction Polymeric films such as polyimide are extensively used in electronic industry as dielectric insulating layers. Thin films deposited on a substrate absorb moisture from the ambient environment, which in

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