WIT Press


Numerical Solution Of Uni-directional Solidification Problem Using The Boundary-fitted Coordinate System

Price

Free (open access)

Paper DOI

10.2495/MB970111

Volume

18

Pages

10

Published

1997

Size

664 kb

Author(s)

M. Saitou

Abstract

Using the boundary-fitted coordinate system, we calculate the uni-directional solidification problem of semiconductor materials. The purpose of this study is to make clear the solid-liquid interface behavior of the materials. We investigate two cases of whether the motion of the melt is taken into consideration or not. Through the calculations that ignore the motion of the melt, some results are obtained: (1) when the temperature profile does not move, the solid-liquid interface shape is determined by the product of the temperature gradient and the thermal conductivity of the materials; (2) when the temperature profile moves at a constant velocity, the growth rate of the solid phase is described by the moving velocity

Keywords