Author(s)

M. Saitou

Abstract

Using the boundary-fitted coordinate system, we calculate the uni-directional solidification problem of semiconductor materials. The purpose of this study is to make clear the solid-liquid interface behavior of the materials. We investigate two cases of whether the motion of the melt is taken into consideration or not. Through the calculations that ignore the motion of the melt, some results are obtained: (1) when the temperature profile does not move, the solid-liquid interface shape is determined by the product of the temperature gradient and the thermal conductivity of the materials; (2) when the temperature profile moves at a constant velocity, the growth rate of the solid phase is described by the moving velocity

Keywords