WIT Press


Finite Element Analysis On Coarse Grained Vector Machines Of Residual Stresses In Plastic IC Packages During Surface Mounting Processes

Price

Free (open access)

Paper DOI

10.2495/HPC970191

Volume

18

Pages

13

Published

1997

Size

913 kb

Author(s)

Sung Yi, Harry H. Hilton & M. Fouad Ahmad

Abstract

Finite element analysis on coarse grained vector machines of residual stresses in plastic 1C packages during surface mounting processes Sung Yi*, Harry H. Hilton^ & M. Fouad Ahmad* "School of Mechanical and Production Engineering, Nanyang Technological University, Nanyang Avenue, Singapore 2263, Republic of Singapore. ^Aeronautical and Astronautical Engineering Department and National Center for Super computing Applications, University of Illinois at Urbana-Champaign, 104 South Wright Street, Urbana, 71 67&07-2P3J U&4 Email: h-hilton@uiuc.edu Abstract Finite element analyses are utilized on a CRAY T94 to calculate hygro- thermally induced anisotropic viscoelastic deformations and stresses in plas- tic 1C packages during surface mounting processes, which is an interdisci- plinary coupled hygro-thermo-structure interaction problem. The subrou- tine for element stiffness calculation is dominated by vector operations and achieves about 432 million floating-point operations per second

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