Dynamic Shear Stress In A Double Lap Bonded Assembly
Free (open access)
167 - 173
G. Challita, R. Othman, P. Guegan, K. Khalil & A. Poitou
This work consists of investigating the dynamic shear behaviour of adhesively bonded assemblies at high rates of loading. A double lap joint sample was adopted, such as the compressive wave, and transformed to a shear loading within the adhesive layer. The tool used for this target is the Split Hopkinson Pressure Bar (SHPB). A temperature of 20°C and hygrometry of 50% are the ambiance conditions used in the sample in order to avoid temperature and humidity effects. The adhesive material is the cyanoacrylate, while the adherent material is steel. The influence of high rates is remarkable on these bonded assemblies. Keywords: Hopkinson bar, adhesively bonded assembly, shear, in-plane load, high strain rate.
Hopkinson bar, adhesively bonded assembly, shear, in-plane load, high strain rate