WIT Press


Computer Aided Design And Reliability Assessment Of Microelectronic Packages

Price

Free (open access)

Paper DOI

10.2495/EL930081

Volume

3

Pages

8

Published

1993

Size

871 kb

Author(s)

P. Lall, C.A. Rust, Xu-Ning Shan & E.B. Hakim

Abstract

Computer aided design and reliability assessment of microelectronic packages P. Lall," C.A. Rust," Xu-Ning Shan/ E.B. Hakim* " CALCE Electronic Packaging Research Center, University of Maryland, College Park, Maryland 20742, USA * Army Research Laboratory, Component Reliability Branch, Electronics & Power Sources Directorate, AMSRL-EP-RA, ABSTRACT Software tools which implement the physics-of-failure approach have been developed for design and reliability assessment of multichip modules based on device architecture, environmental and test loads, and device mission life. The physics-of-failure approach addresses the damage physics of the failure phenomena in microelectronic devices, and is an alternative to empirical handbooks which involve the collection of field failure data and extrapolation of such data to obtain reliability estimates. The software tools developed, address the shortcomings of empirical methods. The structure of the software tools has been devised t

Keywords